- Role of Zinc on Shear Property Evolution between Sn-0.7Cu Solder and Joints
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- 论文类型： 会议论文
- 发表时间： 2011-04-15
- 收录刊物： EI、CPCI-S、SCIE、Scopus
- 卷号： 16
- 页面范围： 807-811
- 关键字： Sn-0.7Cu; zinc; shear; reflowing; microstructure; deposition
- 摘要： Effect of zinc addition on the shear property evolution between Sn-0.7Cu solder alloy and their joints reflowed at 250 degrees C was investigated. The shear strength of Sn-0.7Cu/Cu joint was found to be higher than of Sn-0.7Cu solder alloy. Although a small addition of zinc element strengthened Sn-0.7Cu solder alloy, it decreased the shear strength of Sn-0.7Cu solder joints. Based on the fractography analysis and interfacial microstructure observation, it is proposed that the deposition of Cu-Zn intermetallic toward the interface during reflowing is largely responsible for the shear property evolution between the Sn-0.7Cu solder alloy and their joints. (c) 2010 Published by Elsevier Ltd. Selection and/or peer-review under responsibility of Society for Automobile, Power and Energy Engineering
