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Role of Zinc on Shear Property Evolution between Sn-0.7Cu Solder and Joints
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发布时间: 2019-03-11
发布时间:2019-03-11
论文类型:会议论文
发表时间:2011-04-15
收录刊物:Scopus、SCIE、CPCI-S、EI
卷号:16
页面范围:807-811
关键字:Sn-0.7Cu; zinc; shear; reflowing; microstructure; deposition
摘要:Effect of zinc addition on the shear property evolution between Sn-0.7Cu solder alloy and their joints reflowed at 250 degrees C was investigated. The shear strength of Sn-0.7Cu/Cu joint was found to be higher than of Sn-0.7Cu solder alloy. Although a small addition of zinc element strengthened Sn-0.7Cu solder alloy, it decreased the shear strength of Sn-0.7Cu solder joints. Based on the fractography analysis and interfacial microstructure observation, it is proposed that the deposition of Cu-Zn intermetallic toward the interface during reflowing is largely responsible for the shear property evolution between the Sn-0.7Cu solder alloy and their joints. (c) 2010 Published by Elsevier Ltd. Selection and/or peer-review under responsibility of Society for Automobile, Power and Energy Engineering

程从前

副教授   博士生导师   硕士生导师

任职 : 院长助理,中国腐蚀与防护学会高温专业委员会委员,中国机械工程学会理化检验分委员会委员,辽宁省化工学会腐蚀与防护专业委员会委员

性别: 男

毕业院校:大连理工大学

学位: 博士

所在单位:材料科学与工程学院

学科:材料学

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