- The growth behavior of inteimetallic compound layers of Sn-3Ag/Cu and Sn/Cu joints during soldering and aging
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- 论文类型： 会议论文
- 发表时间： 2006-01-01
- 收录刊物： CPCI-S
- 页面范围： 12-+
- 摘要： The growth behaviors of Sn-3Ag/Cu and Sn/Cu IMC layers during soldering and aging have been investigated. In the soldering experiments, both the Sn-3Ag/Cu and Sn/Cu were soldered at 270 degrees C for different time. In the aging experiments, the Sn-3Ag/Cu and Sn/Cu joints were firstly soldered at 270 degrees C for 60s, and aged at 120 degrees C, 170 degrees C, 190 degrees C for various time. Then all the samples were observed under scanning electron microscopy (SEM). The average thickness of IMC layers was measured by using Q500IW image analysis meter. The results indicated that in the soldering the growth rate of Sn-3Ag/Cu IMC layers was faster than that of Sn/Cu. However, in the aging the growth rate of Sn-3Ag/Cu IMC layers was lower than that of Sn/Cu. The activation energies of Sn-3Ag/Cu and Sn/Cu IMC layers in the aging were about 90KJ/mol and 52KJ/mol respectively.
