大连理工大学主页平台管理系统周平--中文主页-- Grinding performance evaluation of the developed chemo-mechanical grinding (CMG) tools for sapphire substrate

论文成果

Grinding performance evaluation of the developed chemo-mechanical grinding (CMG) tools for sapphire substrate

上一条：电化学机械平坦化抛光垫混合软弹流润滑行为数值研究

下一条： Simulation of CMP Process Based on Mixed Elastohydrodynamic Lubrication Model with

周平 var u_u6_pic = new ImageScale("u_u6_",140,140,true,true);u_u6_pic.addimg("/_resources/group1/M00/00/53/ynZMg1-IDyyADAMxAAiMMyZsgnE918.jpg","","周平","9998");