![]() |
个人信息Personal Information
教授
博士生导师
硕士生导师
性别:男
毕业院校:大连理工大学
学位:博士
所在单位:机械工程学院
学科:机械制造及其自动化
办公地点:大连理工大学机械工程学院知方楼5009
联系方式:pzhou@dlut.edu.cn
电子邮箱:pzhou@dlut.edu.cn
个人简介Personal Profile
主要从事先进制造工艺力学研究,研究领域涉及高性能制造理论与方法、精密/超精密加工技术、原子与近原子尺度制造理论与方法、智能制造方法、机械基础件制造工艺等。以提升高端装备性能及制造工艺优化为目标开展设计制造一体化、工艺过程跨尺度多物理场建模方法和新型加工原理方面的工作,提高现有工艺的稳定性、效率及可控性,并开发具有原子级去除分辨率、高表面完整性、高精度等特征的新型工艺。发展出电致化学抛光和基于固-液复合电解质的电化学抛光新原理和新方法,突破了现有无应力抛光技术加工能力。提出了化学机械抛光跨尺度建模方法,实现了宏微纳跨尺度参数对材料去除率、宏微观形貌演化和缺陷演化的理论解析。提出了强度-效率等多约束条件下的硬脆材料超精密磨削损伤控制方法,解决了半导体基片和硬脆材料构件磨削加工效率提升和损伤控制的矛盾。以第一/通讯作者发表SCI检索论文60余篇,他引2000余次,授权国家发明专利25项(第一发明人22项),国际专利2项,软件著作权1项。
负责国家自然科学基金4项,其它国家级项目或课题5项,相关研究成果应用于中科院上海光机所、兵器集团、华为、Intel、湖北鼎龙、山东潍柴和青岛四方等行业顶尖研究所和企业。
完成科学技术成果鉴定6项(第一完成人2项),4项达到国际领先水平。曾获2012年全国百篇优秀博士学位论文提名奖,2013年辽宁省自然科学奖二等奖,2018年中国机械工业科学技术奖一等奖,2019年国家科技进步一等奖(创新团队),2020年辽宁省技术进步奖二等奖,2023年中国机械工业科学技术奖一等奖。
第十二届上银优秀机械博士论文奖铜奖指导教师。
辽宁省博士优秀学位论文和辽宁省硕士优秀学位论文指导教师。
代表论著Representative Works
- [论文]杨恪.黄宁,周平,邸宏宇.邸宏宇.Modeling of surface microtopography evolution in chemical mechanical polishing considering chemical-mechanical synergy[J],2024,201
- [论文]杨恪.黄宁,周平,邸宏宇,侯长余.邸宏宇,侯长余.Surface microtopography evolution of monocrystalline silicon in chemical mechanical polishing[J],2024,328
- [论文]Lin Wang.Ping Zhou.Ying Yan,Bi Zhang,Renke Kang,Dongming Guo.Chemical–mechanical wear of monocrystalline silicon by a single pad asperity[J],SCI、EI,2017,120:61-71
- [论文]黄宁.周平,Goel, Saurav.Microscopic stress analysis of nanoscratch induced sub-surface defects in a single-crystal silicon wafer[J],2024,82:290-303
- [论文]Wang, Lin.Zhou, P (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Zhou, Ping,Yan, Ying,Kang, Renke,Guo, Dongming.Physically-based modeling of pad-asperity scale chemical-mechanical synergy in chemical mechanical polishing[J],SCIE、EI,2019,138:307-315
- [论文]孟磊.周平,闫英,郭东明.基于不确定性分析的半球陀螺谐振子高性能制造[J],2024
- [论文]P zhou.DM Guo,RK Kang,Y Yan, SC Xu, ZG Wang.A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers.[J],SCI,2016,107:1-7
- [论文]慕卿.闫英,周平,高兴.高兴.Evolution of ring structures and method for inhibition in polishing of fused silica[J],2024,645
- [论文]沈成炜.周平,闫英,郭东明,王冀.王冀.Multi-factor coupling analysis of electric field distribution in electrochemical machining with electrolyte suction tool[J],2024,89:504-516
- [论文]Di, Hongyu.周平,郭东明.Study on Chemical-Mechanical Synergies in Polishing of Ruthenium[A],2024
- [论文]Huang, Jiaji.闫英,郭东明,周平,慕卿,高兴,戴宏迪.慕卿,高兴,戴宏迪.Analysis method of point defects evolution in fused silica under multi-pulse nanosecond laser irradiation[J],2024,32(16):28924-28936
- [论文]Zhou, Ping.Zhou, P (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Yan, Ying,Huang, Ning,Wang, Ziguang,Kang, Renke,Guo, Dongming.Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding[J],SCIE、EI、Scopus,2017,139(8)
- [论文]鲁云祥.Wang, Bo,Wang, Yuezhong,Nishimura, Kazhihito,Jiang, Nan,周平,Goel, Saurav.Novel surface characteristics observed during grinding of polycrystalline diamond[J],2025,684
- [论文]祁永年.郭晓光,周平,宋壮,张婉雪,高兴.宋壮,张婉雪,高兴.Transmittance enhancement of amorphous SiO2 via ultraviolet irradiation to eliminate atomic defects[J],2024,649
- [论文]Li, Ming.郭晓光,康仁科,郭东明,周平.Study on the transformation and control mechanism of amorphous damage during the grinding process of monocrystalline silicon considering grain shapes by MD method[J],187
- [论文]X Chen.P Zhou. RK Kang,ZG Dong.Numerical study on thermal deformation characteristic of water-cooled mirror with interdigitated channels,SCI、EI,2016,98:357-364