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论文类型：期刊论文

发表时间：2010-06-01

发表刊物：RARE METALS

收录刊物：SCIE、EI、CSCD

卷号：29

期号：3

页面范围：276-279

ISSN号：1001-0521

关键字：lapping; mechanical polishing; wafers; surface; subsurface; abrasive

摘要：CdZnTe wafers were machined by lapping and mechanical polishing processes, and their surface and subsurface damages were investigated. The surface damages are mainly induced by three-body abrasive wear and embedded abrasive wear during lapping process. A new damage type, which is induced by the indentation of embedded abrasives, is found in the subsurface. When a floss pad is used to replace the lapping plate during machining, the surface damage is mainly induced by two-body abrasive and three-body abrasive wear, and the effect of embedded abrasives on the surface is greatly weakened. Moreover, this new damage type nearly disappears on the subsurface.