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论文类型：期刊论文

发表时间：2010-06-01

发表刊物：MATERIALS AND MANUFACTURING PROCESSES

收录刊物：SCIE、EI

卷号：25

期号：6

页面范围：407-411

ISSN号：1042-6914

关键字：CdZnTe; Cleavage plane; Damage; Grinding wheel; Plastic deformation; Subsurface; Surface; Stacking faults

摘要：The grinding wheels with grit size of #600 and #2000 are employed to grind CdZnTe (110) and (111) planes, and ground surface and subsurface damages were investigated. The experimental results show the damage types are affected by the crystallographic orientation and grit size. When grinding CdZnTe wafers with grit size of #600, due to different angle between the cleavage plane and ground surface, the surface morphology and directions of cracks on the (111) plane are different from those on the (110) plane. When grinding CdZnTe wafers with grit size of #2000, the (111) plane has less plastic deformation than the (110) plane, and there is obvious direction of stacking faults on subsurface.