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Indexed by:会议论文

Date of Publication:2013-11-03

Included Journals:EI、CPCI-S、Scopus

Volume:609-610

Page Number:891-897

Key Words:piezoresistive; stresses; adhesive bonding

Abstract:In this work, piezoresistive stress sensors test circuit fabricated into the sensitive structure as part of the normal processing procedure is used to measure the stresses difference distribution before and after the assembly. Sensor resistances were recorded before and after the adhesive bonding. Using the theoretical equations, the stresses on the die surface have been calculated from the data of sensor resistances. This technology not only provides a performance diagnostic tool for the sensitive structures and the miniature components, but also presents a design tool for low-stress micro-assemblies of miniature components.