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Thermal assisted ultrasonic bonding of multilayer polymer microfluidic devices

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Indexed by:期刊论文

Date of Publication:2010-01-01

Journal:JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Included Journals:SCIE、EI、Scopus

Volume:20

Issue:1

ISSN No.:0960-1317

Abstract:A new approach to fabricating multilayer microfluidic devices of poly(methyl methacrylate) (PMMA) was presented. Substrates were preheated to 20-30 degrees C lower than glass transition temperature (T-g) of the material by a hot plate. Then low-amplitude ultrasonic vibration was employed to generate facial heat at the interface of the PMMA layers. Two crossover micro-separation channel networks and a micro mixer were integrated in a four-layer microfluidic device using this method. The burst pressure of the bonded channel was more than 0.65 MPa. In order to demonstrate the performance of this technique, as many as 12 PMMA layers with micro-channels were successfully bonded together at one time. The average depth loss ratio of micro-channels was 0.6% and the tensile strength was 0.67 MPa. Multilayer poly(ethylene terephthalate) (PET) and cyclo-olefin polymer (COP) substrates were also successfully bonded. This study provided a potential method for constructing complex channel networks for polymer microfluidic devices.

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