Release Time:2019-03-09 Hits:
First Author: 娄志峰
Disigner of the Invention: 王晓东,王立鼎,陈文蕊,马勇
Application Number: CN201110355311.6
Authorization Date: 2011-11-11
Authorization Number: CN102500835A
Prev One:一种粘弹热触发热塑性聚合物超声波压印方法
Next One:一种LED器件的硅基板与铜微热管集成制造方法