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一种基于多层掩蔽层制作微结构的体硅加工方法

Release Time:2019-03-09  Hits:

First Author: 罗怡

Disigner of the Invention: 郑英松,张彦国,王晓东,张宗波

Application Number: CN200910304439.2

Authorization Date: 2009-07-16

Authorization Number: CN101613077

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