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个人信息Personal Information
副教授
博士生导师
硕士生导师
性别：男
毕业院校：上海交通大学
学位：博士
所在单位：材料科学与工程学院
学科：材料表面工程. 材料学
电子邮箱：
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- [1]蒋智涛.李玉阁,雷明凯.An inverse problem in estimating fracture toughness of TiAlN thin films by finite element method based on nanoindentation morphology[J],Vacuum,2021,192:110458-
- [2]孟笛.蒋智涛,李玉阁,高剑英,雷明凯.靶基距对Cu/Si(100)薄膜结构和残余应力的影响[J],中国表面工程,2021,33(6):86-92
- [3]李玉阁.卢跃磊,蒋智涛,潘楠,雷明凯.On the influence of the micropulse on Nb thin films deposited by MPPMS and DOMS: A comparative study[J],Surface and Coatings Technology,2021:127464-
- [4]Zheng, B.C..吴志立,Wu, B.,李玉阁,雷明凯.A global plasma model for reactive deposition of compound films by modulated pulsed power magnetron sputtering discharges[J],JOURNAL OF APPLIED PHYSICS,2021,121(17)
- [5]李玉阁.朱小鹏,雷明凯.高功率调制脉冲磁控溅射沉积TiAlSiN纳米复合涂层对钛合金基体抗氧化性能的影响研究[J],表面技术,2021,49:220-227
- [6]Li, Y. G..Lei, MK (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Surface Engn Lab, Dalian 116024, Peoples R China..Pan, N.,Lei, M. K.,Yuan, H.,Jiang, Z. T..Phase composition and mechanical properties of homostructure NbN nanocomposite coatings deposited by modulated pulsed power magnetron sputtering[J],SURFACE & COATINGS TECHNOLOGY,2020,385
- [7]Meng, D..Lei, MK (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Surface Engn Lab, Dalian 116024, Peoples R China..Li, Y. G.,Jiang, Z. T.,Lei, M. K..Stick-climb-slip induced damage mode in Cu/Si(100) thin films,deposited by modulated pulsed power magnetron sputtering during scratch[J],VACUUM,2020,174
- [8]李玉阁.Lei, Ming-Kai(surfeng@dlut.edu.cn).雷明凯,袁海,蒋智韬.高功率调制脉冲磁控溅射沉积NbN涂层特征工艺参数研究[J],表面技术,2019,48(8):302-308
- [9]Meng, D..Lei, MK (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Surface Engn Lab, Dalian 116024, Peoples R China..Jiang, Z. T.,Lei, M. K.,Li, Y. G..Scratch behavior and FEM modelling of Cu/Si(100) thin films deposited by modulated pulsed power magnetron sputtering[J],SURFACE & COATINGS TECHNOLOGY,2019,363:25-33
- [10]孟笛.蒋智韬,雷明凯,李玉阁.Scratch behavior and FEM modelling of Cu/Si(100) thin films deposited by modulated pulsed power magnetron sputtering[A],2019,363:25-33