董志刚

个人信息Personal Information

教授

博士生导师

硕士生导师

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:机械工程学院

学科:机械制造及其自动化

办公地点:机械知方楼@5126

联系方式:dongzg@dlut.edu.cn

电子邮箱:dongzg@dlut.edu.cn

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Design and evaluation of soft abrasive grinding wheels for silicon wafers

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论文类型:期刊论文

发表时间:2013-04-01

发表刊物:PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE

收录刊物:SCIE、EI

卷号:227

期号:B4

页面范围:578-586

ISSN号:0954-4054

关键字:Soft abrasive; grinding wheel; silicon wafer; chemomechanical polishing

摘要:The objective of this study is to design and evaluate soft abrasive wheels for silicon wafer grinding. In this study, CeO2, SiO2, Fe2O3 and MgO soft abrasives are used in the design of soft abrasive grinding wheels. The soft abrasive grinding wheels are then used to grind silicon wafers and compared with diamond wheel grinding and chemomechanical polishing. This study demonstrates that the newly designed soft abrasive grinding wheels are generally superior to diamond wheel grinding or chemomechanical polishing in terms of wafer surface/subsurface quality, wheel dressability, grinding ratio and material removal rate. This study further identifies the MgO soft abrasive grinding wheel as the best of the four soft abrasive grinding wheels. Discussion is provided to explore material removal mechanisms, wheel dressing characteristics and wafer surface finish and quality of the newly designed soft abrasive grinding wheels.