bIUfNntvrIB837L7ekopdRB9Vqul99UAtgGOKoBWrkgoNHCtWhO1vEscj7X0
Current position: Home >> Scientific Research >> Research Projects

聚四氟乙烯印刷线路板的研发

Release Time:2019-03-21  Hits:

Leading Scientist: 毛德祥

Project Participants: 李崇实,Xia Shufeng,SUN Peng

Project Source: 企事业单位委托科技项目

Status: 结题

Supported by: Dalian Chongda Circuit Co., Ltd.

Nature of Project: 横向

Date of Project Approval: 2014-10-30

Scheduled Completion Time: 2017-10-30

Date of Project Initiation: 2014-10-30

Date of Project Completion: 2024-07-05

Prev One:厚铜大于5oz线路板的研发和量产

Next One:基于形变在线调控技术研究微热板气体传感器在应力作用下的稳定性和可靠性