Current position: Home >> Scientific Research >> Research Projects

厚铜大于5oz线路板的研发和量产

Release Time:2019-03-21  Hits:

Leading Scientist: 毛德祥

Project Participants: Xia Shufeng

Project Source: 企事业单位委托科技项目

Status: 结题

Supported by: Dalian Chongda Circuit Co., Ltd.

Nature of Project: 横向

Date of Project Approval: 2016-03-01

Scheduled Completion Time: 2017-05-01

Date of Project Initiation: 2017-05-01

Date of Project Completion: 2024-07-05

Prev One:基于导光金属毛细管的便携式、高灵敏度光度计研究

Next One:聚四氟乙烯印刷线路板的研发