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论文类型：期刊论文

发表时间：2012-09-25

发表刊物：Advanced Materials Research

收录刊物：EI、CPCI-S、Scopus

卷号：565

页面范围：330-335

ISSN号：9783037854679

关键字：Chemical mechanical polishing; Elastohydrodynamic Lubrication; Layered elastic theory; Rough surface; Contact mechanic

摘要：A simulation framework based on the mixed elastohydrodynamic lubrication (mixed EHL) model has been used successfully to explain some phenomena observed in Chemical mechanical polishing (CMP) process. However, the pad deformation model adopted in various CM? simulation frameworks, such as Winkler elastic foundation model or elastic half-space model, can not correctly describe the deformation features of pad, especially at the wafer periphery. In this study, a layered elastic theory, which can calculate the pad deformation with similar accuracy but lower computational cost than 3D finite element method (FEM), is introduced into the mixed EHL, and it is significant to predict the contact pressure distribution more accurately than existing approaches. Further, the material removal rate can be predicted accurately, it is useful for the study of the mechanism of CMP and the optimization of the CMP processing parameters.