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论文类型：期刊论文

发表时间：2017-01-01

发表刊物：ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY

收录刊物：SCIE、EI

卷号：6

期号：4

页面范围：P178-P183

ISSN号：2162-8769

摘要：Stiffness analysis of the grooved pad is important to study the mechanical action and slurry flow in CMP process. This paper investigates the nonlinear compression behavior of the grooved pad and then presents a mathematical model to calculate the compressive stiffness of the polishing pad with micro roughness and macro grooved textures. The compressive stiffness of two kinds of pads with different surface structures is analyzed. The results are compared with the FEM model and the uniform thick layer (UTL) model, which are extensively employed in the analysis of pad stiffness. It verifies that the proposed model shows a good agreement with the FEM model. Additional experiments are conducted to validate the accuracy of the proposed semi-empirical formula considering the compressive stiffness of the asperity layer. It is worth mentioning that the error will be more than 24% in calculating the tested grooved pad stiffness by traditional UTL model. In the proposed model, the relationship between the pad stiffness and the geometrical parameters is depicted explicitly, which is convenient for designing the groove structure to achieve a desirable polishing performance. (c) 2017 The Electrochemical Society. All rights reserved.