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论文类型：会议论文

发表时间：2008-09-20

收录刊物：EI

卷号：53-54

页面范围：265-272

摘要：Among the properties of polishing pad, the surface roughness plays a crucial role in CMP (Chemical Mechanical Planarization) process. However, there is no acknowledged standard for measuring and characterizing the roughness of pad surface in 3D measurement. In this paper Talysurf CLI 2000 working on the principle of dynamic confocal measurement was initially suggested to measure the 3D surface topography of polishing pads through theoretical and experimental analysis. In addition, based on the Nyquist folding frequency and the statistical theory, a selection technique for sampling interval and sampling area was proposed and verified through experiments. The results showed that Talysurf CLI 2000 is more suitable than New View to measure the 3D surface topography of polishing pads. 2μm sampling interval, 0.5×0.5mm2sampling area and 10μm interval, 1×1mm2area are respectively recommended for IC1000/SubaIV and SubaIV polishing pad.