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论文类型：期刊论文

发表时间：2009-01-01

发表刊物：Key Engineering Materials

收录刊物：EI、Scopus

卷号：389-390

页面范围：475-480

ISSN号：10139826

摘要：In the process of CMP SiO2 ILD, the nano-particle with high surface energy in slurry has an essential impact on the efficiency and quality of CMP. In this paper the mode of nano-particle on the surface of SiO 2 ILD is analysed and adhesion removal model corresponding to that is established. Through cycle polishing experiments, the change of nano-particle size and the state of particle surface before and after polishing is observed with TEM and Zeta potential analyzer, based on which the adhesion removal model is verified.