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论文类型：期刊论文

发表时间：2009-01-01

发表刊物：Key Engineering Materials

收录刊物：EI、Scopus

卷号：389-390

页面范围：498-503

ISSN号：10139826

摘要：The calculating model of surface non-uniformity of polishing pad and the kinematical model between polishing pad and conditioner are initially established. Then the effects of several conditioning parameters were investigated by using the two models. The results of simulation and calculation show that the width ratio of diamond band of conditoner and the rotation speed at the same speed ratio between pad and conditioner have little effect on the surface non-uniformity of polishing pad, while at high non-integer rotation speed ratio, the surface non-uniformity of polishing pad is better than that at low integer speed ratio. The research results are available to select appropriate conditioning parameters especially for the stringent requirement of within-wafer non-uniformity in next generation IC.