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论文类型：会议论文

发表时间：2010-06-05

收录刊物：EI、Scopus

摘要：Ultrasonic-vibration-Assisted grinding (UVAG) combines the material removal mechanisms of diamond grinding and ultrasonic machining. Models have been presented to predict material removal rate and edge chipping and many experiments have also been conducted. However, there were no models on cutting force in UVAG of brittle materials until the authors developed one. Based on this developed model, this paper reports a systematic study on cutting force in UVAG of brittle materials using a 26 factorial design. The main effects, two-factor and three-factor interaction effects on cutting force are revealed and compared with those obtained experimentally.