个人信息Personal Information
教授
博士生导师
硕士生导师
性别:男
毕业院校:大连理工大学
学位:博士
所在单位:机械工程学院
电子邮箱:guodm@dlut.edu.cn
Investigation on material removal rate in rotation grinding for large-scale silicon wafer
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论文类型:期刊论文
发表时间:2004-01-01
发表刊物:11th International Manufacturing Conference in China
收录刊物:SCIE、CPCI-S
卷号:471-472
页面范围:362-368
ISSN号:0255-5476
关键字:silicon wafers; material removal rate; rotation grinding method; backgrinding; cup grinding wheel; IC
摘要:In this paper, the formula of material removal rate (MRR) in wafer rotation grinding process is deduced based on kinematics. The main effect on MRR of the grit size and the process parameters, including the rotational speed of the cup grinding wheel, the down feed rate of the grinding wheel spindle and the rotational speed of the chuck table, is both theoretically and experimentally investigated. The influence on MRR of the cup wheel grinding status, the geometric dimension of the cup-grinding wheel, the rigidity of the grinding machine and the coolant is also analyzed. The investigating results show that, the increase of the grit size and the down feed rate of the cup grinding wheel results in great increase of the MRR; the MRR increases as the rotational speed of the cup wheel increases whereas the MRR reduces and the ground surface becomes bad due to size effect if the rotational speed of the cup wheel is overlarge; in normal grinding, the MRR decreases as the rotational speed of the chuck table increases. The results provide a theoretical basis to improve grinding efficiency, reduce grinding cost and select the proper parameters of grinding process.