郭东明

个人信息Personal Information

教授

博士生导师

硕士生导师

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:机械工程学院

电子邮箱:guodm@dlut.edu.cn

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Study on the Surface Damage Layer in Multiple Grinding of Quartz Glass by Molecular Dynamics Simulation

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论文类型:期刊论文

发表时间:2017-01-01

发表刊物:JOURNAL OF NANO RESEARCH

收录刊物:SCIE、EI

卷号:46

页面范围:192-202

ISSN号:1662-5250

关键字:Multiple grinding; Molecular dynamics; Densification; Nanoindentation hardness; Damage layer

摘要:The paper focuses on the surface damage of quartz glass in multiple grinding, so as to find out the machining parameters that can improve the surface quality of quartz glass. Molecular dynamics (MD) method is adopted to machine the quartz glass. Firstly, the initial grinding is done on quartz glass with the depth of 12 angstrom. Based on the initial grinding, no feed grinding processes are done for three times separately and the feed grinding processes are carried out on the damage layer left by the previous process. The coordination number (CN) is used to gain the surface topographies of quartz glass and mark the regions of densification. Moreover, the damage layer thickness of different machined surface is also calculated. By analyzing the density of different surface damage layers, the regulation of the density distribution is obtained. Finally, the nanoindentation hardness is gained by different load-displacement curves in nanoindentation simulation. The results show that the first no feed grinding and the second feed grinding can improve the accuracy and quality of grinding. Too many no feed grinding processes and other feed grinding processes will induce serious damage of the machined surface, which is clearly showed in the obvious increase in the density, hardness and thickness of the damage layer. At last, the results of the density analysis and nanoindentation also proved that the densification and hardness of quartz glass cannot increase unlimitedly. The results can be applied in the ultra-precision grinding of quartz glass to control the thickness of damage layer and improve the quality of processing.