郭东明

个人信息Personal Information

教授

博士生导师

硕士生导师

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:机械工程学院

电子邮箱:guodm@dlut.edu.cn

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Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers

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论文类型:期刊论文

发表时间:2013-03-01

发表刊物:INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

收录刊物:SCIE、EI

卷号:66

页面范围:54-65

ISSN号:0890-6955

关键字:Silicon wafer; Grinding marks; Cup wheel; Axial run out; Flatness; Waviness

摘要:A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness. In this paper, the grinding marks formation mechanism was clarified, a grinding marks formation model and an angular wavelength model were developed, and a grinding marks suppression method was proposed. A series of grinding experiments were carried out to verify the developed models and investigate the effect of the wafer rotational speed, the wheel rotational speed, the infeed rate, the axial run out of the cup wheel and the spark out time. The results show that: (1) grinding marks are waviness generated on silicon wafers caused by non-uniform material removal circumferentially due to the axial run out of the cup wheel; (2) grinding marks present multiple angular wavelengths characteristics; (3) the angular wavelength of grinding marks is a one-variable function of the rotational speed ratio of the wheel to the wafer; and (4) grinding marks could be suppressed significantly by properly selecting the rotational speed ratio. (C) 2012 Elsevier Ltd. All rights reserved.