点击次数：

论文类型：期刊论文

发表时间：2004-01-01

发表刊物：ADVANCES IN ABRASIVE TECHNOLOGY VI

收录刊物：Scopus、SCIE、EI

卷号：257-258

页面范围：33-38

ISSN号：1013-9826

关键字：molecular dynamics; simulation; nanometric grinding

摘要：Molecular dynamics (MD) simulation is an effective microscopic approach to analyze the mechanism of nanometric machining from an atomistic viewpoint. Until today several applications of the method have been found dealing with indentation tests or cutting processes. In this paper, based on analyzing the development tendency of machining and the requirements of recent nanometric science and technology, the background and significance both in theoretical and practical aspects of MD simulation are illustrated. The scientific foundation, methods and basic steps of MD are presented. The authors established a grinding MD model according to the characteristics of the grinding process. Finally, the authors simulated the grinding process at an indentation depth of 1 silicon atomic layer and explained the mechanism of the process.