Chengzhi Hu
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Molecular dynamics simulation of effects of nanoparticles on frictional heating and tribological properties at various temperatures
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Indexed by:Journal Papers

Date of Publication:2020-06-01

Journal:FRICTION

Included Journals:SCIE

Volume:8

Issue:3

Page Number:531-541

ISSN No.:2223-7690

Key Words:nanoparticles; molecular dynamics; temperature; tribological properties

Abstract:The temperature of a friction pair exerts considerable influence on the tribological behavior of a system. In two cases, one with and the other without Cu (copper) nanoparticles, the temperature increase in friction pairs caused by frictional heating and its tribological properties at various temperatures are studied by using the molecular dynamics approach. The results show that temperature distribution and surface abrasion are significantly improved by the presence of Cu nanoparticles. This is one of the reasons for the improvements in tribological properties achieved in the presence of nanoparticles. The temperature and range of influence of frictional heating for the model without nanoparticles are significantly increased with the increase in the sliding velocity; however, in the model with nanoparticles, the temperature gradient is confined to the area near the Cu film. With an increase in the temperature of the friction pair, the improvement in anti-wear properties associated with the presence of Cu nanoparticles becomes more significant.

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Associate Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates

Gender:Male

Alma Mater:大连理工大学

Degree:Doctoral Degree

School/Department:能源与动力学院

Discipline:Energy and Environmental Engineering

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