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Design of protective and high sensitivity encapsulation layers in wearable devices.

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Date of Publication:2024-07-02

Journal:Science China. Technological sciences

Volume:66

Issue:1

Page Number:223-232

ISSN No.:1674-7321

Key Words:elastomeric encapsulation; strain-isolation effect; stress-isolation effect; transversely isotropic medium; wearable devices

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