Design of protective and high sensitivity encapsulation layers in wearable devices
Release Time:2025-04-27 Hits:
Indexed by: Journal Papers
Document Code: 361884
Date of Publication: 2023-01-18
Journal: SCIENCE CHINA-TECHNOLOGICAL SCIENCES
Volume: 66
Issue: 1
Page Number: 223-232
ISSN: 1674-7321
Key Words: ELECTRONICS
CN: 11-5845/TH