Release Time:2019-03-09 Hits:
First Author: 高仁璟
Disigner of the Invention: Shutian Liu,Yongcun Zhang,张延康,赵剑
Authorization Date: 2011-12-29
Authorization Number: ZL201310014595.1
Prev One:一种基于变厚度梁结构的高阶模态微质量传感器
Next One:一种基于变厚度板的多稳态变体结构