Indexed by:Journal Article

Date of Publication:2013-07-01

Journal:JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME

Included Journals:Scopus、EI、SCIE

Volume:80

Issue:4

ISSN:0021-8936

Key Words:transfer printing; viscoelasticity; interfacial fracture toughness; pulling speed; pull-off force

Abstract:Transfer printing is a volatile tool to retract micro devices from a donor substrate via elastomeric stamps, from which the devices are grown or fabricated, followed by printing to a receiver substrate where the device is assembled to an array for integration in various applications. Among the five approaches of transfer printing summarized in the paper, the viscoelastic property of stamps is widely adopted to modulate the interfacial adhesion between the stamp and devices by applying different pulling speeds. A viscoelastic model for transfer printing is analytically established. It shows that the interfacial adhesion increases with pulling speed, which is verified by the experiments and numerical simulations.