Title of Paper:An analytical model of strain isolation for stretchable and flexible electronics

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Date of Publication:2011-02-07

Journal:APPLIED PHYSICS LETTERS

Included Journals:Scopus、SCIE、EI

Volume:98

Issue:6

ISSN No.:0003-6951

Abstract:One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length. (C) 2011 American Institute of Physics. [doi:10.1063/1.3553020]