Title of Paper:A strain-isolation design for stretchable electronics

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Date of Publication:2010-12-01

Journal:ACTA MECHANICA SINICA

Included Journals:SCIE、EI、ISTIC、Scopus

Volume:26

Issue:6

Page Number:881-888

ISSN No.:0567-7718

Key Words:Strain isolation; Thin film; Substrate; Adhesive; Stretchable electronics

Abstract:Stretchable electronics represents a direction of recent development in next-generation semiconductor devices. Such systems have the potential to offer the performance of conventional wafer-based technologies, but they can be stretched like a rubber band, twisted like a rope, bent over a pencil, and folded like a piece of paper. Isolating the active devices from strains associated with such deformations is an important aspect of design. One strategy involves the shielding of the electronics from deformation of the substrate through insertion of a compliant adhesive layer. This paper establishes a simple, analytical model and validates the results by the finite element method. The results show that a relatively thick, compliant adhesive is effective to reduce the strain in the electronics, as is a relatively short film.