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Dong, Chong, Shang, Min, guoying, Chen, Xiangxu, zhangjun, Changlong, Ma Haoran, mahaitao.Significant Effect of Temperature and Solders on the Growth Behavior of CU6Sn5on (110) Cu Single Crystal[A],2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,2022
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姚金冶, 王立, 郭世浩, 李孝夫, 陈祥序, 赏敏, Ma Haoran, mahaitao, Ma, Haitao.First-Principles Study of Cu Addition on Mechanical Properties of Ni3Sn4-Based Intermetallic Compounds[J],METALS,2024,14(1)
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Zhang, Liyuan, 张力元, 缑敏, Ma Haoran, xiaxiaochuan, lianghongwei, Ma, Haoran, Xia, Xiaochuan.Laser Etching Process of TSV and Reliability Analysis of TSV-based IC structure by Finite Element Simulation[A],2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT,2011
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赏敏, 姚金冶, 张丹, 苏小林, mahaitao, wangyunpeng, Ma Haoran, Ma, Haitao, Wang, Yunpeng.Preparation and soldering performance of SAC305@Sn-bi Core-shell solder balls based on eutectic co-deposition[J],MATERIALS CHARACTERIZATION,2024,211
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潘帅屹, 许慧敏, 谭昕, Xu, Huimin, Tan, Xin, Ma Haoran, xiaxiaochuan, lianghongwei, Ma, Haoran.Reliability Modeling of High Power DUV LED Chips Based on New Thin Film Packaging Technology[A],2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT,2011
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电容器多物理场耦合仿真技术开发, 企事业单位委托科技项目, 2024-07-17, 在研
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高端集成电路封装高速贴片技术及装备攻关, 其他课题, 2024-10-08, 在研
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柔性微电子集成系统研发与应用, 省、市、自治区科技项目, 2022-06-30, 在研
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高效率氮化硼单晶中子探测材料与器件关键技术研究, 国家自然科学基金项目, 2023-08-24, 在研
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基于新型金属卤化物叠层闪烁体的多光谱型多能X射线探测器的研发, 地市厅局（含县）项目, 2023-09-28, 在研
