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论文类型：期刊论文

发表时间：2018-03-01

发表刊物：MEASUREMENT SCIENCE AND TECHNOLOGY

收录刊物：SCIE、EI

卷号：29

期号：3

ISSN号：0957-0233

关键字：time-domain thermoreflectance; thermal conductivity; interfacial thermal conductance; transform matrix; simplified heat transfer model

摘要：Heat transfer in nanostructures is of critical importance for a wide range of applications such as functional materials and thermal management of electronics. Time-domain thermoreflectance (TDTR) has been proved to be a reliable measurement technique for the thermal property determinations of nanoscale structures. However, it is difficult to determine more than three thermal properties at the same time. Heat transfer model simplifications can reduce the fitting variables and provide an alternative way for thermal property determination. In this paper, two simplified models are investigated and analyzed by the transform matrix method and simulations. TDTR measurements are performed on Al-SiO2-Si samples with different SiO2 thickness. Both theoretical and experimental results show that the simplified tri-layer model (STM) is reliable and suitable for thin film samples with a wide range of thickness. Furthermore, the STM can also extract the intrinsic thermal conductivity and interfacial thermal resistance from serial samples with different thickness.