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Indexed by:期刊论文

Date of Publication:2012-02-01

Journal:MATERIALS RESEARCH INNOVATIONS

Included Journals:SCIE、EI、Scopus

Volume:16

Issue:1

Page Number:51-55

ISSN No.:1432-8917

Key Words:Al/Mg compound materials; Interface; Microstructure

Abstract:Al/Mg compound materials were fabricated by a solid-liquid bonding method. The well bonded interface with a transition layer can be obtained. There were two kinds of interface structures in the ingot. The microstructures and bonding properties of Al/Mg interface were studied. The results showed that the brittle interface layer was composed mainly of intermetallic compound Al(12)Mg(17) and Al(3)Mg(2) at the top part and Al(3)Mg(2) at the bottom part of ingot respectively. The reason why two kinds of interface structures existed was explained.