Release Time:2022-10-20 Hits:
First Author: 李廷举
Disigner of the Invention: 王同敏,曹志强,卢一平,Yubo ZHANG
Institution: 材料科学与工程学院
Application Number: CN102554195A
Authorization Number: CN201110460205.4
Next One:添加稀土La的原位TiB<sub>2</sub>增强铜基复合材料及其制备方法