点击次数：

论文类型：期刊论文

发表时间：2017-07-10

发表刊物：Journal of Physics: Conference Series

收录刊物：Scopus、EI、CPCI-S

卷号：842

期号：1

ISSN号：17426588

摘要：The inclined bimaterial interface crack problem is studied from theoretical and computational aspects. The original problem is transformed into an eigen value problem by using the symplectic approach, and the eigen solution are obtained. A Symplectic Analytical Singular Element (SASE), of which the interior fields are described by the obtained eigen solutions, is developed. The stress intensity factors (SIFs) can be calculated directly without any post-processing. Numerical example on a square bimaterial plate containing an inclined crack is provided to validate the proposed method. The comparison of the predicted results with the existing result indicates that the proposed method is accurate for the modelling of the inclined bimaterial interface crack. ? Published under licence by IOP Publishing Ltd.