点击次数：

论文类型：期刊论文

发表时间：2013-04-01

发表刊物：ACTA MECHANICA SOLIDA SINICA

收录刊物：SCIE、EI、CSCD

卷号：26

期号：2

页面范围：151-160

ISSN号：0894-9166

关键字：analytical method; eigenvalues; interface; crack; symplectic space

摘要：With the help of the coordinate transformation technique, the symplectic dual solving system is developed for multi-material wedges under antiplane deformation. A virtue of present method is that the compatibility conditions at interfaces of a multi-material wedge are expressed directly by the dual variables, therefore the governing equation of eigenvalue can be derived easily even with the increase of the material number. Then, stress singularity on multi-material wedges under antiplane deformation is investigated, and some solutions can be presented to show the validity of the method. Simultaneously, an interesting phenomenon is found and proved strictly that one of the singularities of a special five-material wedge is independent of the crack direction.