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论文类型：期刊论文

发表时间：2012-09-01

发表刊物：ENGINEERING FRACTURE MECHANICS

收录刊物：SCIE、EI、Scopus

卷号：91

页面范围：103-116

ISSN号：0013-7944

关键字：Kirchhoff plate; Interface crack; Analytical singular element; Stress intensity factor; Symplectic duality system

摘要：By introducing appropriate transformations, a circular sector Kirchhoff plate bending composed of dissimilar materials with both straight sides free is led into symplectic duality system in this paper. The problem is solved by using the symplectic eigenfunction expansion method, and analytical expressions of symplectic eigenvalues and eigensolutions are derived. Using the symplectic eigensolutions as a displacement model, an analytical singular element is developed for the interface crack. Bending stress intensity factors can be determined directly from the expansion coefficients of the eigensolution. Numerical results show that the present method has a high accuracy in the calculation of stress intensity factors. (C) 2012 Elsevier Ltd. All rights reserved.