An Efficient Response Spectrum Method for Fatigue Life Prediction of Electronic Packaging Solder Joints
Release Time:2026-07-10 Hits:
Indexed by: Journal Papers
Document Code: 476335
Date of Publication: 2025-08-18
Journal: FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES
Volume: 48
Issue: 8
Page Number: 3368-3380
ISSN: 8756-758X
Key Words: RELIABILITY