Primary Participant:康仁科
Co-author:朱祥龙,董志刚,周平,闫志瑞,吕洪明,郭东明,高尚,库黎明,徐凯,张军,金洙吉,郭晓光,王紫光,王永涛
Co-author:朱祥龙,董志刚,周平,闫志瑞,吕洪明,郭东明,高尚,库黎明,徐凯,张军,金洙吉,郭晓光,王紫光,王永涛
Title of Achievement:300mm硅片超精密磨削技术与装备
Code of Certificate:R1801028-02
Affiliation of Participants:大连理工大学
Supported by:国家计划；国家自然科学基金
Granted by:中国机械工业科学技术奖评审委员会
Order of Affiliations of Authors:1
School Sign:大连理工大学
Type of Outcome:NewTechnology, New Craftsmanship
Level of Award:huojiangjibieyiji
Grade of Award:一等奖
Type of Award:省部级
Number of Participants:15
Discipline:Engineering
First-Level Discipline:Mechanical Engineering
Date of Award:2018年10月25日