Indexed by:期刊论文
Journal:Advanced Materials Research
Included Journals:EI、CPCI-S、Scopus
Volume:565
Page Number:609-614
ISSN No.:9783037854679
Key Words:Wafer grinder; Precision grinding; Silicon wafer; Design; On-line monitoring
Abstract:This study presents design of an ultra-precision wafer grinder which incorporates state-of-the-art automatic supervision and control system. The wafer grinder is characterized by wafer surface shape control, grinding forces and wafer thickness monitoring systems. The design provides a totally integrated solution to the ultra-precision grinder that is capable of grinding silicon wafers with surface roughness Ra<3 nm and total thickness variation<2 mu m/300mm.
Date of Publication:2012-09-25