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Degree:Doctoral Degree
School/Department:机械工程学院

zhuxianglong

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Gender:Male

Alma Mater:大连理工大学

Patents

Current position: Home / Scientific Research / Patents
一种易解理半导体晶体的加工方法
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First Author:Shang GAO
Disigner of the Invention:Renke Kang,Dong Zhigang,何宜伟,zhuxianglong,李洪钢
Application Number:201910867396.2
Authorization Date:2019-09-12
Authorization number:ZL 201910867396.2
Authorization Date: 2019-09-12