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论文类型：期刊论文

发表时间：2011-09-01

发表刊物：PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE

收录刊物：Scopus、SCIE、EI

卷号：225

期号：C9

页面范围：2232-2241

ISSN号：0954-4062

关键字：grinder; chuck topography; silicon wafer; chuck dressing; modelling

摘要：Silicon wafers are widely used in integrated circuits. This article addresses an important aspect of flat wafer grinding: grinder design. An advanced grinder with two-spindle and three-workstation for empty set300 mm silicon wafer based on the principles of in-feed grinding was successfully developed. A mathematical model on topography control was developed for the first time to provide a totally integrated solution for dressing chuck with given topography. The developed model was then applied to predict the chuck topography or to adjust the obliquity adjustment device according to the parameters of ground chuck. Finally, the pilot experiments on two groups of chucks, which demonstrate the correctness of topography control are included.