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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：知方楼5130
联系方式：15998535043
电子邮箱：zhuxianglong@dlut.edu.cn
扫描关注
- [121]郭江, 朱祥龙, 董志刚, 郭晓光, 康仁科, 郭东明.6th International Conference on Nanomanufacturing[A],2018
- [122]秦炎, 康仁科, 董志刚, 王毅丹, 杨洁, 朱祥龙.Burr removal from measurement data of honeycomb core surface based on dimensionality reduction an...[J],Measurement Science and Technology,2018,29(11):115010-115010
- [123]郭江, 朱祥龙, 董志刚, 郭晓光, 康仁科, 郭东明.Finishing of rectangular microfeatures by localized vibration-assisted magnetic abrasive polishin...[A],2018
- [124]Bao, Yan, Kang, Renke, Dong, Zhigang, Zhu, Xianglong, Wang, Changrui, Guo, Dongming, ZG (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Sch Mech Engn, 2 Linggong Rd, Dalian 116024, Peoples R China..Multipoint support technology for mirror milling of aircraft skins[J],MATERIALS AND MANUFACTURING PROCESSES,2018,33(9):996-1002
- [125]Dong, Zhigang, Zheng, Feifei, Zhu, Xianglong, Kang, Renke, Zhang, Bi, Liu, Zhiqiang, RK (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Characterization of material removal in ultrasonically assisted grinding of SiCp/Al with high v...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2017,93(5-8):2827-2839
- [126]朱祥龙, 高尚, 康仁科, 董志刚, 崔岩.全日制专业型硕士实践能力培养体系之探析[J],实验室科学,2017,20(5):229-232
- [127]王紫光, 高尚, 朱祥龙, 董志刚, 康仁科, Kang, Ren-Ke(Kangrk@dlut.edu.cn).硅片低损伤磨削砂轮及其磨削性能[J],光学精密工程,2017,25(10):2689-2696
- [128]董志刚, 段佳冬, 康仁科, 朱祥龙, 郑非非, Kang, Ren-Ke(kangrk@dlut.edu.cn).超声辅助磨削硬脆材料芯棒直径预测模型[J],光学精密工程,2017,25(8):2106-2112
- [129]康仁科, 赵海洋, 朱祥龙, 焦振华, Zhu, X., Dalian University of Technology, Key Laboratory for Precision, Non-traditional Machining Technology of Ministry of EducationChina, email: zhuxianglong@dlut.edu.cn.激光晶片抛光中磨粒运动轨迹分布均匀性分析[J],金刚石与磨料磨具工程,2017,37(3):40-45
- [130]牛景露, 朱祥龙, 康仁科, 王毅丹, 董志刚, Dong, Z., Key Laboratory for Precision, Non-traditional Machining Technology of Ministry of Education, Dalian University of TechnologyChina, email: dongzg@dlut.edu.cn.圆片刀超声切削蜂窝芯材料试验研究[J],金刚石与磨料磨具工程,2017,37(3):62-68
- [131]Zhu, Xianglong, Chen, Xiuyi, Liu, Haijun, Kang, Renke, Zhang, Bi, Dong, Zhigang, ZG (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..An empirical equation for prediction of silicon wafer deformation[J],MATERIALS RESEARCH EXPRESS,2017,4(6)
- [132]Gao, Shang, Huang, Han, Zhu, Xianglong, Kang, Renke, RK (reprint author), Dalian Univ Technol, Sch Mech Engn, Inst Adv Mfg Technol, 2 Linggong Rd, Dalian 116024, Peoples R China..Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a ...[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2017,63:97-106
- [133]陈修艺, 刘海军, 朱祥龙, 康仁科, 董志刚, Dong, Z., Key Laboratory for Precision, Non-traditional Machining Technology of Ministry of Education, Dalian University of TechnologyChina, email: dongzg@dlut.edu.cn.金刚石砂轮磨削单晶硅片面形变化规律[J],金刚石与磨料磨具工程,2017,37(2):6-10
- [134]高尚, 朱祥龙, 康仁科, 郭东明, 王紫光, 张璧, Kang, Renke(kangrk@dlut.edu.cn).微晶玻璃超精密磨削的表面/亚表面损伤及其材料去除机理研究[J],机械工程学报,2017,53(7):180-188
- [135]董志刚, 朱祥龙, 康仁科, 张璧.Characterisation of material removal in ultrasonically assisted grinding of SiCp/Al with high vol...[J],The International Journal of Advanced Manufacturing Technology,2017,93:2827-2839
- [136]吴鑫, 董志刚, 康仁科, 朱祥龙, 王毅丹, 刘津廷.直刃尖刀形状对超声辅助切削系统振动性能的影响[J],航空制造技术,2016,22:52-57
- [137]曹克, 康仁科, 朱祥龙, 刘津廷, 董志刚.微晶刚玉砂轮磨削钛合金TC17磨削力研究[J],金刚石与磨料磨具工程,2016,36(5):1-7,14
- [138]Zhu X.L., Jiao Z.H., Kang R.K., Wang Z.G., Xu H..A novel method for grinding wheel setting based on acoustic emissions[A],2016,874:79-84
- [139]Song D.B., Zhu X.L., Kang R.K., Jin Z.J., Shi S.J., Zhang B..Experimental research on dressing parameters of the plate in planetary double-sided grinding proc...[A],2016,874:172-177
- [140]Liu, Haijun, Zhu, Xianglong, Kang, Renke, Dong, Zhigang, Chen, Xiuyi, ZG (reprint author), 2 Linggong Rd, Dalian 116024, Peoples R China..Three-point-support method based on position determination of supports and wafers to eliminate ...[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2016,46:339-348