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论文类型：会议论文

发表时间：2012-12-08

收录刊物：EI、CPCI-S、Scopus

卷号：300-301

页面范围：585-588

关键字：Micro-coil sensor array; UV-LIGA process; Non-destructive testing; Micro-crack

摘要：A micro-coil array is designed and fabricated in this contribution by MEMS (Micro Electro Mechanical Systems) approach. The array's width is from a dozen microns to several tens of microns. UV-LIGA process is used to fabricate the array by means of sputtering, lithography and electroforming. The sensor array is based on 300 mu m thick silicon wafer, and is composed of single excitation Cu coils, two serial detection coils. Detection coils are sized from 10 mu mx10 mu m, 20 mu mx15 mu m to 30 mu mx15 mu m respectively, with 10 turns. Successful fabrication of the micro-coil sensor demonstrates the feasibility of UV-LIGA process for miniaturization of micro-coils.