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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院5138
联系方式：0411-84706059
电子邮箱：kangrk@dlut.edu.cn
Study on chemical effects of H2O2 and glycine in the Copper CMP process using ReaxFF MD
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论文类型：期刊论文
发表时间：2020-04-01
发表刊物：APPLIED SURFACE SCIENCE
收录刊物：EI、SCIE
卷号：508
ISSN号：0169-4332
关键字：ReaxFF MD; CMP; Copper; H2O2; Glycine
摘要：ReaxFF MD simulation was employed to simulate the chemical mechanical polishing (CMP) process of copper in four different polishing slurries (pure H2O, aqueous H2O2, aqueous glycine and a mixture aqueous H2O2 and glycine) in order to investigate the microchemistry mechanism during the copper CMP process. Results indicate that the increment of H2O2 concentration can inhibit the adsorption of H2O on the copper surface and promote the dissociation of H2O. After adding glycine to polishing slurry, the adsorption of H2O on the copper surface is also inhibited and there are copper complex (CueC(2)H(5)O(2)N) forming on the copper surface. Copper atoms on the topmost surface are weaken under the action of H2O2 and glycine, which is beneficial to atoms removal. The amount of copper atoms removed is the least in pure water and the most in a mixture of aqueous H2O2 and glycine during the copper CMP process. In addition, the amount of copper atoms removed increases first and then decreases with the increment of H2O2 concentration. This work shows atomic insights into copper atoms removal under the combination of chemical and mechanical effects, which provides an effective method to choose CMP slurry.