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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院5138
联系方式：0411-84706059
电子邮箱：kangrk@dlut.edu.cn
Effects of pressure and slurry on removal mechanism during the chemical mechanical polishing of quartz glass using ReaxFF MD
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论文类型：期刊论文
发表时间：2020-03-01
发表刊物：APPLIED SURFACE SCIENCE
收录刊物：EI、SCIE
卷号：505
ISSN号：0169-4332
关键字：Quartz glass; CMP; ReaxFF MD; Removal mechanism; Aqueous H2O2; Pressure
摘要：Reactive force field molecular dynamics (ReaxFF MD) simulation was employed to study the interfacial interaction during the Chemical mechanical polishing (CMP) process of quartz glass. Results indicated that dissociation and adsorption of H2O occurred on the quartz glass surface in pure H2O, and the dissociation of H2O could hydroxylate quartz glass surface to form Si-OH bonds. In addition, it was found that the surface hydroxylation degree is higher in aqueous H2O2. The formation of Si-O-Si bonds plays a key role in the CMP process. Dehydrogenation and dehydroxylation are two ways to form interface bridge bonds. The interface bridge bonds between abrasive and substrate could transmit mechanical force with the movement of abrasive. Interface pressure affects the number and forms of atoms removed. With the increment of pressure, the removal form gradually changes from single removal mode to chain removal mode. The effect of aqueous H2O2 on the removal process was also studied by adding different amount of OH group on the quartz glass surface. This work helps us reveal the removal mechanism in the CMP process of quartz glass from an atomic perspective.