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一种三维封装芯片堆叠用金属间化合物键合方法及键合结构

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First Author:Zhao Ning

Disigner of the Invention:Mingliang Huang,钟毅,赵建飞,许利伟,mahaitao

Application Number:CN201510069934.5

Authorization Date:2015-02-09

Authorization number:CN104716059A

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