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论文类型：期刊论文

发表时间：2017-03-01

发表刊物：FRONTIERS OF MECHANICAL ENGINEERING

收录刊物：SCIE

卷号：12

期号：1,SI

页面范围：18-32

ISSN号：2095-0233

关键字：micro machining; cutting; electro discharge machining (EDM); laser machining; focused ion beam (FIB)

摘要：Device miniaturization is an emerging advanced technology in the 21st century. The miniaturization of devices in different fields requires production of micro- and nano-scale components. The features of these components range from the sub-micron to a few hundred microns with high tolerance to many engineering materials. These fields mainly include optics, electronics, medicine, bio-technology, communications, and avionics. This paper reviewed the recent advances in micro- and nano-machining technologies, including micro-cutting, micro-electrical-discharge machining, laser micro-machining, and focused ion beam machining. The four machining technologies were also compared in terms of machining efficiency, workpiece materials being machined, minimum feature size, maximum aspect ratio, and surface finish.