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论文类型： 会议论文

发表时间： 2009-08-10

收录刊物： EI、CPCI-S、Scopus

页面范围： 798-801

摘要： LEDs (Light Emitting Diodes) that assembled using flip-chip technology are today used as long-life, energy efficient, environmentally friendly light sources. However, the flip chip solder joints have to meet high requirements. Therefore, their performance and quality are crucial for the integrity of the assembly, which in turn is vital to the overall function of the LED. Au-30at.%Sn eutectic alloy is the generally used solder in electro-optical assemblies due to its excellent thermal and mechanical properties. Au-Sn solder bumps can be obtained by sequential electroplating of Au and Sn layers or by co-electroplating Au-Sn alloys from a single solution. In the present work, Au-Sn alloys have been co-electroplated from a non-cyanide, sulfite-based stable solution which contains Na(3)Au(SO(3))(2) (gold sodium sulfite) as the source of gold and SnSO(4) (stannous sulfate) as the source of Sn. Na(2)SO(3) (sodium sulfite) is added as the complexing agent for gold and an additional commercial complexing agent for Sn. The effect of the [Au]/[Na(2)SO(3)] molar ratio in the plating solution on the composition of the deposits, surface morphology and plating rate has been investigated. It was shown that the [Au]/[Na(2)SO(3)] molar ratio of 1/24 proved to be the best one with respect to plating rate and surface morphology in the present experiment. When the Sn(2+) concentration is 0.03 mol/L, the optimum concentration for co-electroplating Au-Sn alloys is Au(I) concentration of 0.02 mol/L and Na(2)SO(3) concentration of 0.48 mol/L, corresponding to the [Au]/[Na(2)SO(3)] molar ratio of 1/24.