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The growth Behaviors of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic field
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论文类型: 会议论文
发表时间: 2007-06-26
收录刊物: EI、CPCI-S、Scopus
页面范围: 127-+
摘要: The growth behaviors of intermetallic compound (IMC) layers in solid-liquid interfacial reactions of Snl.5Cu/Cu in various intensities of high magnetic field have been investigated. The results show that the growth of IMC layers has been accelerated by high magnetic field through the comparison of growth kinetics of IMC layers among 0T to 2.5T magnetic field. IMC grains in. high magnetic field are much bigger than that in 0T. By the analyzing of XRD patterns of IMC layers, it can be found that the orientations of IMC have been changed by magnetic field.

程从前

副教授   博士生导师   硕士生导师

任职 : 院长助理,中国腐蚀与防护学会高温专业委员会委员,辽宁省化工学会腐蚀与防护专业委员会委员

性别: 男

毕业院校:大连理工大学

学位: 博士

所在单位:材料科学与工程学院

学科:材料学

电子邮箱:cqcheng@dlut.edu.cn

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